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Palladium Gold Plating for High Temperature Application

IP.com Disclosure Number: IPCOM000087070D
Original Publication Date: 1976-Dec-01
Included in the Prior Art Database: 2005-Mar-03
Document File: 1 page(s) / 11K

Publishing Venue

IBM

Related People

Albrecht, WM: AUTHOR [+2]

Abstract

A process is designed to plate blister-free, palladium-gold electrodeposits on a pin or similar surface, when such coatings are to be heated to brazing or diffusion temperatures ranging from 400 degrees to 650 degrees C. A specific application would be the provision of a palladium-gold electrodeposit on an iron-nickel-cobalt alloy.

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Palladium Gold Plating for High Temperature Application

A process is designed to plate blister-free, palladium-gold electrodeposits on a pin or similar surface, when such coatings are to be heated to brazing or diffusion temperatures ranging from 400 degrees to 650 degrees C. A specific application would be the provision of a palladium-gold electrodeposit on an iron- nickel-cobalt alloy.

In the first step of the process, palladium is plated using conventional plating techniques on a properly treated iron-nickel-cobalt surface. Next, the total gold thickness required is plated in several discrete layers, rather than as a single thick plate. After each discrete layer is plated, a high temperature diffusion or sintering is carried out with the first such diffusion or sintering step being at a temperature of about 650 degrees C. The subsequent diffusion or sintering steps are carried out at somewhat lower temperatures with the final step being carried out at a temperature of about 450 degrees C. The annealing times can be regulated to control the amount of palladium diffused into the gold.

It is recognized that other plating processes, such as nickel-gold, rather than palladium-gold, may be desired and could use a similar form of processing.

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