Browse Prior Art Database

Blowing in CO(2) Free Air to Stabilize a Chemical Copper Bath

IP.com Disclosure Number: IPCOM000087122D
Original Publication Date: 1976-Dec-01
Included in the Prior Art Database: 2005-Mar-03
Document File: 1 page(s) / 11K

Publishing Venue

IBM

Related People

Bruennert, H: AUTHOR [+3]

Abstract

Chemical copper baths are used to generate a conductor image and to establish plated-through holes in nonmetallic substrates.

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Blowing in CO(2) Free Air to Stabilize a Chemical Copper Bath

Chemical copper baths are used to generate a conductor image and to establish plated-through holes in nonmetallic substrates.

During plating of required thick copper deposits, undesirably rough metal surfaces are formed due to the unstable bath solution. By blowing in CO(2)-free air in finest distributed form, the bath solution becomes chemically stabilized, so that extraneous copper reduction is prevented and smooth metal deposits result.

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