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Noncorrosive Bonding Technique for Silicon Nozzles in Ink Jet Printing

IP.com Disclosure Number: IPCOM000087218D
Original Publication Date: 1976-Dec-01
Included in the Prior Art Database: 2005-Mar-03
Document File: 2 page(s) / 35K

Publishing Venue

IBM

Related People

Giordano, FP: AUTHOR [+2]

Abstract

This is a method of bonding a silicon nozzle to a stainless steel ink jet head with a laminate that can withstand corrosive inks.

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Noncorrosive Bonding Technique for Silicon Nozzles in Ink Jet Printing

This is a method of bonding a silicon nozzle to a stainless steel ink jet head with a laminate that can withstand corrosive inks.

Certain corrosive inks attack all epoxies and most glasses. It is also known that these inks etch bare silicon, and it is unlikely that a silicon eutectic could withstand the highly corrosive properties of the ink. Solder bonding of ink jet nozzles, along with dissimilar metals bonding, has proven inadequate because of the electro-corrosion that goes on between the surfaces while they are exposed to the ink.

A TEFLON* film placed between a SiO(2) chip and a stainless steel ink jet head successfully forms a bond that is able to withstand pressures up to 50 psi, as well as withstand attack by corrosive inks. When the TEFLON film is brought up to a temperature of ~ 300 degrees C, it begins to low. This flowing action fills the orange-peeled surface of the silicon, thus producing a strong bond.

The following technique, as illustrated in the figure, is used to bond a SiO(2) nozzle chip 2 to a stainless steel ink jet head 3 with a TEFLON laminate 4.
1) The TEFLON laminate 4, which is .001" thick,

is cut to .700 x .170 to window frame the SiO(2)

chip 2.
2) A slot 5 is then punched in the center of the

laminate 4 (slot size .500 x .025).
3) TEFLON laminate 4 and the stainless steel head 3

are cleaned three times in trichlor, acetone and

alcohol.
4) The three components are...