Browse Prior Art Database

Heated Base Airtrack Tool System for Heated Media or Reactive Wafer Transport/Processing

IP.com Disclosure Number: IPCOM000087307D
Original Publication Date: 1977-Jan-01
Included in the Prior Art Database: 2005-Mar-03
Document File: 3 page(s) / 77K

Publishing Venue

IBM

Related People

Boomhower, GW: AUTHOR [+3]

Abstract

This article describes a heated airtrack tool system which will accept wafers from a wafer transport system, heat them to a desired temperature and return them to the transport system in a controlled manner.

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Heated Base Airtrack Tool System for Heated Media or Reactive Wafer Transport/Processing

This article describes a heated airtrack tool system which will accept wafers from a wafer transport system, heat them to a desired temperature and return them to the transport system in a controlled manner.

The heated airtrack (Fig. 1) is comprised of three basic elements, a heater block 10, a heat diffusion plate 11 mounted on the heater block 10 and directional airtrack 12 situated on the heat diffusion plate. The heater block 10 is provided with a pair of U-shaped channels 14 and 15, in which are inserted a plurality of heater elements 16. The heat diffusion plate 11 is then mounted over the heater block and mechanically secured thereto by screws or the like.

The heat diffusion plate is provided with a multiplicity of pairs of vacuum channels 17, 18 and 19, each of which is connected to interior channels 20, 21 and 22 which extend to exterior ports 23, 24 and 25 respectively, so that vacuum may be selectively applied to each pair of vacuum ports. This heat diffusion block also assures that the heat from the heater strips 16 is uniformly distributed and that hot and cold spots on the above mounted airtrack 12 will be substantially reduced or eliminated. On top of this heat diffusion block 11 is mounted a suitably drilled air block 12.

The airtrack 12 is provided with a plurality of channels 26 (Figs. 2 and 3) which are coupled through an exterior orifice 27 to a suitable high pressure low volume gas supply (not shown). These interconnected air channels 26 in turn conduct air to a multiplicity of central orifices 29, inclined in the direction in which the supported wafer is to be directed, and to a multiplicity of buffer orifices 28 aligned on either side of the central orifice 29 and directed inwardly toward the central orifice 29 to maintain and locate the wafer over the directional orifices 29.

The...