Browse Prior Art Database

Multidirectional Expansion Packaging

IP.com Disclosure Number: IPCOM000087315D
Original Publication Date: 1977-Jan-01
Included in the Prior Art Database: 2005-Mar-03
Document File: 2 page(s) / 37K

Publishing Venue

IBM

Related People

Burry, JM: AUTHOR [+2]

Abstract

A multidirectional expansion package for large-scale integration (LSI) chips combines backbonding, matched expansion carrier and lead frame packaging techniques to produce a high performance LSI chip package that can be implemented in a metallized ceramic module or could be extended into a very high performance single-chip module package.

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Multidirectional Expansion Packaging

A multidirectional expansion package for large-scale integration (LSI) chips combines backbonding, matched expansion carrier and lead frame packaging techniques to produce a high performance LSI chip package that can be implemented in a metallized ceramic module or could be extended into a very high performance single-chip module package.

Referring to the figure, the chip 11 is bonded to a heat sink 13 to which are attached a number of heat fins 15. The matched expansion carrier is, for example, a piece of silicon 17 that has the desired chip footprint and fan-out pattern. The chip 11 is attached to the matched expansion carrier 17 through conventional solder joints. The matched expansion carrier 17 is connected to the ceramic (or other substrate) 19 using leads 21 of lead frame technology. This completes the path from the chip pads to the module I/O pins 22 and allows for the thermal expansion in the Z direction via the lead frame design, which permits expansion without stressing the solder joints. A suitable cap 25 seals the chip cavity against the outside environment.

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