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Multimodule Heat Sink

IP.com Disclosure Number: IPCOM000087324D
Original Publication Date: 1977-Jan-01
Included in the Prior Art Database: 2005-Mar-03
Document File: 2 page(s) / 55K

Publishing Venue

IBM

Related People

Bauman, AH: AUTHOR [+3]

Abstract

Integrated circuits are often mounted in modules which have a metallic cover. Transferring heat away from the integrated circuit involves, first, transferring the heat from the integrated circuit to the module assembly and, then, transferring heat from the module assembly to some external heat sink. Where the amount of heat which must be dissipated is relatively small, the metallic cover for the module can be exposed to air and the bottom of the module attached to a printed-circuit board through pins. The heat from the integrated circuit is thereby dissipated both through the circuit board on which the module is mounted and through the metallic can which covers the module. In some applications, the amount of heat dissipated in this manner is not sufficient.

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Multimodule Heat Sink

Integrated circuits are often mounted in modules which have a metallic cover. Transferring heat away from the integrated circuit involves, first, transferring the heat from the integrated circuit to the module assembly and, then, transferring heat from the module assembly to some external heat sink. Where the amount of heat which must be dissipated is relatively small, the metallic cover for the module can be exposed to air and the bottom of the module attached to a printed-circuit board through pins. The heat from the integrated circuit is thereby dissipated both through the circuit board on which the module is mounted and through the metallic can which covers the module. In some applications, the amount of heat dissipated in this manner is not sufficient.

This structure enhances the amount of heat which can be dissipated from an integrated circuit module. Referring to the figures, the modules 10 are mounted on a circuit board 15 in a conventional manner. The top of the modules 10, however, are placed in receptacles 20 on a heat sink 30. (The structure is shown unassembled in Fig. 1 and assembled in Fig. 2.)

A low-melt solder 40 (which may be the type of solder which has a negative shrinkage upon solidification) surrounds each of the modules and makes an intimate connection between the modules and the heat sink 30. The heat sink 30 can include a passage 50 for circulating water, which will carry away heat.

It is noted that, with this type o...