Browse Prior Art Database

Protection of Chip Solder Connections

IP.com Disclosure Number: IPCOM000087344D
Original Publication Date: 1977-Jan-01
Included in the Prior Art Database: 2005-Mar-03
Document File: 1 page(s) / 11K

Publishing Venue

IBM

Related People

Figliozzi, JJ: AUTHOR [+2]

Abstract

Solder joints have found successful application for solid state conduction by reflow in flip-chip joining techniques. However, prior to joining, the solid state devices are oftentimes subjected to storage, during which time the solder joints are subjected to reaction with the ambient so as to introduce a reliability factor on joining.

This text was extracted from a PDF file.
This is the abbreviated version, containing approximately 100% of the total text.

Page 1 of 1

Protection of Chip Solder Connections

Solder joints have found successful application for solid state conduction by reflow in flip-chip joining techniques. However, prior to joining, the solid state devices are oftentimes subjected to storage, during which time the solder joints are subjected to reaction with the ambient so as to introduce a reliability factor on joining.

It has been found that the effect of ambients, during storage, can be minimized by cleaning the solder and then coating with polyurethane and acrylic films.

1