Browse Prior Art Database

Barrier Layer for Multilayer Liftoff Mask

IP.com Disclosure Number: IPCOM000087355D
Original Publication Date: 1977-Jan-01
Included in the Prior Art Database: 2005-Mar-03
Document File: 2 page(s) / 29K

Publishing Venue

IBM

Related People

Cortellino, CA: AUTHOR

Abstract

Certain solvents which are used in a multilayer metal liftoff mask structure 1 tend to crack the underlying layer(s). By using a non-organic soluble polymer as a barrier layer for the bottom layer, the cracking is prevented.

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Barrier Layer for Multilayer Liftoff Mask

Certain solvents which are used in a multilayer metal liftoff mask structure 1 tend to crack the underlying layer(s). By using a non-organic soluble polymer as a barrier layer for the bottom layer, the cracking is prevented.

For example, a 5000 Angstrom to 10000 Angstrom thick film 2 of polymethylmethacrylic acid (spun from a water solution) and a polysulfone bottom layer 3 on semiconductor 4 prevented cracking in the final photoresist layer 5 which is formed on polydimethylsiloxane resin barrier layer 6. Cellulose acetates can also be used as a bottom layer. It is also possible to use the polymethylmethacrylic acid layer as the bottom layer itself rather than as a barrier layer.

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