Browse Prior Art Database

Bubble Generation for Cooling of Semiconductor Chips in Liquid Boiling Regime

IP.com Disclosure Number: IPCOM000087402D
Original Publication Date: 1977-Jan-01
Included in the Prior Art Database: 2005-Mar-03
Document File: 2 page(s) / 43K

Publishing Venue

IBM

Related People

Oktay, S: AUTHOR

Abstract

This positive bubble generator provides continuous bubbles independent of boiling conditions for a circuit module with liquid cooling. The bubble generator consists of a small diameter hollow cube 10 made of a material compatible with the liquid coolant 12. The tube has a suitable number of fine holes 14, like those on a garden spray hose, and extends the whole length of the lower part of the cooling chamber 16. The tube 10 is connected to a small electric pump 18 on the outside of the module. Another tube 20, with one end opening into the vapor space 24 at the top of the module 26, is connected to the inlet of the pump.

This text was extracted from a PDF file.
At least one non-text object (such as an image or picture) has been suppressed.
This is the abbreviated version, containing approximately 87% of the total text.

Page 1 of 2

Bubble Generation for Cooling of Semiconductor Chips in Liquid Boiling Regime

This positive bubble generator provides continuous bubbles independent of boiling conditions for a circuit module with liquid cooling. The bubble generator consists of a small diameter hollow cube 10 made of a material compatible with the liquid coolant
12. The tube has a suitable number of fine holes 14, like those on a garden spray hose, and extends the whole length of the lower part of the cooling chamber 16. The tube 10 is connected to a small electric pump 18 on the outside of the module. Another tube 20, with one end opening into the vapor space 24 at the top of the module 26, is connected to the inlet of the pump.

With this arrangement, the vapor generated by the boiling chips 30 is pumped from the vapor space 24 in the module to the bottom where the vapor is forced out the holes 14 in the lower tube in the form of bubbles. These bubbles, as they rise through the liquid, help those chips which are at an unstable boiling state to go into boiling. A suitable two-way vent 32 is also provided with a filter so that measured amounts of noncondensable gases, such as air, may be introduced into the system to create active cavities on chips to promote boiling. Also, the vent would be automatically activated to introduce external gases when there is insufficient vapor to be pumped from the vapor space inside the module.

The tubes 10 and 20 described here can be an integral part of the modu...