Browse Prior Art Database

Thermal Enhancement of Modules

IP.com Disclosure Number: IPCOM000087403D
Original Publication Date: 1977-Jan-01
Included in the Prior Art Database: 2005-Mar-03
Document File: 2 page(s) / 40K

Publishing Venue

IBM

Related People

Hultmark, EB: AUTHOR [+3]

Abstract

A liquid metal filled sac 10 can be placed over chips 12 on a module to provide a pliable, thermally conductive. but electrically isolated, heat sink, which can easily be disassembled for repair.

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Thermal Enhancement of Modules

A liquid metal filled sac 10 can be placed over chips 12 on a module to provide a pliable, thermally conductive. but electrically isolated, heat sink, which can easily be disassembled for repair.

A thin but reliably tear-resistant membrane-like plastic sac 10 contains a metal which is liquid at or near room temperature. Gallium is a most likely choice for the metal while the sac can be made of one of many plastics such as polyolefins and silicones.

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