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Pluggable Substrate Tinning Device

IP.com Disclosure Number: IPCOM000087495D
Original Publication Date: 1977-Feb-01
Included in the Prior Art Database: 2005-Mar-03
Document File: 2 page(s) / 26K

Publishing Venue

IBM

Related People

Babinski, S: AUTHOR [+3]

Abstract

The present device is used in the tinning of pluggable substrates having gold or palladium pins and it allows for economical tinning of such substrates with a larger range of tolerances (warpage, flatness, etc.).

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Pluggable Substrate Tinning Device

The present device is used in the tinning of pluggable substrates having gold or palladium pins and it allows for economical tinning of such substrates with a larger range of tolerances (warpage, flatness, etc.).

The tinning device comprises a titanium handle 1 onto which a titanium box 2 is riveted and/or welded. The titanium box wall has a recess on which the pluggable substrate 5 rests during the dip tinning process. Before the substrate is placed in the fixture, flux 3 is added. The substrate is then placed in the fixture box and a removable spring clip 4 is clamped over the substrate and fixture. The substrate is now ready for vibration tinning.

The recess in the wall of the box enables the seating of the bottom of the substrate below the surface of the box. This greatly increases the protection of the pins and allows the tinning of substrates which have a larger degree of warpage and also those which are larger in size.

The flux reservoir in the box provides the following important features:

(1) The vapor pressure of the flux solvent along with the air

in the cavity provides an increased positive back pressure

which prevents the solder from flowing into the cavity and

wetting the pins.

(2) The flux in the cavity also keeps everything in solution

and prevents the possibility of burning flux or other

contaminants on to the bottom layer of the substrate. It

also prevents the build up of organic contaminants on the

fixture its...