Browse Prior Art Database

Modular Organic Carrier

IP.com Disclosure Number: IPCOM000087496D
Original Publication Date: 1977-Feb-01
Included in the Prior Art Database: 2005-Mar-03
Document File: 2 page(s) / 81K

Publishing Venue

IBM

Related People

Arvanitikis, NC: AUTHOR

Abstract

A modular organic carrier, as shown in Fig. 1, provides a means of powering, cooling and communicating with a wafer. The package may contain chips 11 attached to a silicon wafer carrier 13, which could be a full wafer or a fraction of it in a silicon-on-silicon structure, or it may contain embedded circuitry, or a combination of the two. Power and communication are provided by the lead frames 15 which connect the pinned organic carrier 17 to the wafer 13.

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Modular Organic Carrier

A modular organic carrier, as shown in Fig. 1, provides a means of powering, cooling and communicating with a wafer. The package may contain chips 11 attached to a silicon wafer carrier 13, which could be a full wafer or a fraction of it in a silicon-on-silicon structure, or it may contain embedded circuitry, or a combination of the two. Power and communication are provided by the lead frames 15 which connect the pinned organic carrier 17 to the wafer 13.

A good thermal path to the exterior of the package is provided by the wafer to heat spreader interface 19, permitting the use of conduction cooling as well as the more conventional convection cooling. As shown, the thermal interface is connected directly to a heat sink 21.

A more detailed cross-sectional area of the package is shown in Fig. 2. The pinned organic carrier 17 is connected via an organic spacer 23 to the heat sink
21. In the internal cavity of the pinned organic carrier is mounted the thermal interface 19, which is soldered to the silicon carrier 13. Suitable chips 11 are mounted on the carrier 13 and the lead frame 15 provides the interconnection between the carrier 13 and the pinned organic carrier 17. A cap 25, which covers the chips 11 on the carrier 13, may include an appropriate seal 27 to hermetically seal the package.

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