Browse Prior Art Database

SYLGARD Topseal Dispense to Top Layer of Substrates

IP.com Disclosure Number: IPCOM000087499D
Original Publication Date: 1977-Feb-01
Included in the Prior Art Database: 2005-Mar-03
Document File: 2 page(s) / 56K

Publishing Venue

IBM

Related People

Cutting, LR: AUTHOR

Abstract

When the topseal SYLGARD* is dispensed onto the top layer of a module assembly, it is sometimes necessary, in order to insure that all circuitry is covered, that the operator touch up the dispensed SYLGARD with an artist's brush and, also, to tilt and rock the assembly. Some of the SYLGARD tends to wick over the edges of the substrate and consequently must be inspected and removed.

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SYLGARD Topseal Dispense to Top Layer of Substrates

When the topseal SYLGARD* is dispensed onto the top layer of a module assembly, it is sometimes necessary, in order to insure that all circuitry is covered, that the operator touch up the dispensed SYLGARD with an artist's brush and, also, to tilt and rock the assembly. Some of the SYLGARD tends to wick over the edges of the substrate and consequently must be inspected and removed.

The present fixture defines a process by which SYLGARD can be dispensed uniformly to the top layer and there contained without operator intervention. As shown in Fig. 1, the fixture operates so that the SYLGARD will be stamped or blotted on the top layer to the area to be covered, rather than dispensed from a needle. If a resilient and absorbent material is located under the SYLGARD reservoir and is exactly the same size as the outside rows of pins, from center to center as shown in Fig. 2, the SYLGARD will evenly cover all circuitry. By controlling contact time and pressure of the stamp to the substrate surface, the amount of SYLGARD deposited can be regulated. The dispensing operation should be done on a heated, level work station. * Trademark of Dow Corning Corporation.

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