Browse Prior Art Database

Externally Applied Chip Thermal Connection

IP.com Disclosure Number: IPCOM000087519D
Original Publication Date: 1977-Feb-01
Included in the Prior Art Database: 2005-Mar-03
Document File: 2 page(s) / 26K

Publishing Venue

IBM

Related People

Herdzik, RJ: AUTHOR [+3]

Abstract

The figure illustrates a package which will remove heat from the back of a contacts-down mounted semiconductor chip 10 on a substrate 11 via a solder bump 12 to cover 13 which may, in turn, have an air or liquid heat sink (not shown). The solder bump 12 thermal connection is made from outside the cover through a hole 14 in the cover 13. This thermal connection could be made by low temperature solder reflow after the module is otherwise formed. Cooling fins or studs (not shown) for thermal heat dissipation on the module exterior can be applied during this solder reflow. Pins 15 are input/output electrical connections to the package.

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Externally Applied Chip Thermal Connection

The figure illustrates a package which will remove heat from the back of a contacts-down mounted semiconductor chip 10 on a substrate 11 via a solder bump 12 to cover 13 which may, in turn, have an air or liquid heat sink (not shown). The solder bump 12 thermal connection is made from outside the cover through a hole 14 in the cover 13. This thermal connection could be made by low temperature solder reflow after the module is otherwise formed. Cooling fins or studs (not shown) for thermal heat dissipation on the module exterior can be applied during this solder reflow. Pins 15 are input/output electrical connections to the package.

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