Browse Prior Art Database

Extended Chip Package

IP.com Disclosure Number: IPCOM000087520D
Original Publication Date: 1977-Feb-01
Included in the Prior Art Database: 2005-Mar-03
Document File: 2 page(s) / 26K

Publishing Venue

IBM

Related People

Koopman, NG: AUTHOR

Abstract

The figure illustrates a package which will remove heat from the back of a contacts-down mounted semiconductor chip 10 on a substrate 11 via a solder bump 12 to the cover 13 which may, in turn, have an air or liquid heat sink (not shown). The thermal resistance across the gap can be reduced by use of an extender 14 composed of a thin flat plate with good thermal conductivity. Pins 15 are input/output electrical connections to the package.

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Extended Chip Package

The figure illustrates a package which will remove heat from the back of a contacts-down mounted semiconductor chip 10 on a substrate 11 via a solder bump 12 to the cover 13 which may, in turn, have an air or liquid heat sink (not shown). The thermal resistance across the gap can be reduced by use of an extender 14 composed of a thin flat plate with good thermal conductivity. Pins 15 are input/output electrical connections to the package.

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