Browse Prior Art Database

Ground Plane Cover

IP.com Disclosure Number: IPCOM000087521D
Original Publication Date: 1977-Feb-01
Included in the Prior Art Database: 2005-Mar-03
Document File: 2 page(s) / 39K

Publishing Venue

IBM

Related People

Koopman, NG: AUTHOR

Abstract

The figure illustrates a package which will remove heat from the back of a contacts-down mounted semiconductor chip 10 on a substrate 11 via a solder bump 12 connected to a ground plane cover structure 13. The cover 13 is shaped to conform to the surface of the substrate 11 while being spaced therefrom with a gap that is optimized for an air dielectric ground plane. The cover 13 is crimped at 14 to the substrate 11. Ground pins 15 are electrically connected to the cover 13 by solder connections 16. A clip 17 on the extended surface may be used for forced air cooling.

This text was extracted from a PDF file.
At least one non-text object (such as an image or picture) has been suppressed.
This is the abbreviated version, containing approximately 100% of the total text.

Page 1 of 2

Ground Plane Cover

The figure illustrates a package which will remove heat from the back of a contacts-down mounted semiconductor chip 10 on a substrate 11 via a solder bump 12 connected to a ground plane cover structure 13. The cover 13 is shaped to conform to the surface of the substrate 11 while being spaced therefrom with a gap that is optimized for an air dielectric ground plane. The cover 13 is crimped at 14 to the substrate 11. Ground pins 15 are electrically connected to the cover 13 by solder connections 16. A clip 17 on the extended surface may be used for forced air cooling.

1

Page 2 of 2

2

[This page contains 2 pictures or other non-text objects]