Browse Prior Art Database

Flux Removal Tool

IP.com Disclosure Number: IPCOM000087535D
Original Publication Date: 1977-Feb-01
Included in the Prior Art Database: 2005-Mar-03
Document File: 2 page(s) / 47K

Publishing Venue

IBM

Related People

Christensen, RG: AUTHOR [+2]

Abstract

With an increasing number of thermal connection pads on semiconductor chips for flip-chip joining to substrates, the removal of flux is becoming increasingly difficult.

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Flux Removal Tool

With an increasing number of thermal connection pads on semiconductor chips for flip-chip joining to substrates, the removal of flux is becoming increasingly difficult.

The tool shown (and immersed in a solvent flow) enables the application of more positive pressure of the cleaning solution under the bonded chip. The pivot on the rotary drive enables the angle of incidence of the joined chip/substrate to the cleaning solution to be variable for optimum pressure. Also, the direction of flow is variable for optimizing the angle of attack on the chip-substrate combination.

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