Browse Prior Art Database

Test Connector

IP.com Disclosure Number: IPCOM000087601D
Original Publication Date: 1977-Feb-01
Included in the Prior Art Database: 2005-Mar-03
Document File: 2 page(s) / 60K

Publishing Venue

IBM

Related People

Cefarelli, FP: AUTHOR [+2]

Abstract

The test connector includes a resilient, low-impedance, multipath contact element 10 formed by die-compressing a fine knitted wire mesh to a desired shape and density. Typically, the wire is .002-.005 inches in diameter and consists of good electrically conductive material, such as gold-plated beryllium copper.

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Test Connector

The test connector includes a resilient, low-impedance, multipath contact element 10 formed by die-compressing a fine knitted wire mesh to a desired shape and density. Typically, the wire is .002-.005 inches in diameter and consists of good electrically conductive material, such as gold-plated beryllium copper.

The tester is constructed utilizing a matrix of contact elements 10 contained in a guidance insulator member 12, as shown in Fig. 1. Fig. 2 shows the insulator member 12 attached to a diagnostic board 14 which places the contact 10 under an initial compression to the board land 16. The pinned product 17 is guided into engagement with the contact 10 by self-centering countersinks 18 in the guidance insulator member 12. The result is a conformal, conductive path between the pinned circuit package 17 and the diagnostic board 14.

It should be appreciated that the contact 10 is easily replaceable since it is not attached solidly and provides a low resistance through many parallel paths. Furthermore, it has the additional reliability obtained through redundance of many discrete contact points. The contacts 10 can be made with a relatively small diameter so as to handle dense, pinned packages 17.

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