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Preventing Edge Break Through

IP.com Disclosure Number: IPCOM000087642D
Original Publication Date: 1977-Feb-01
Included in the Prior Art Database: 2005-Mar-03
Document File: 2 page(s) / 29K

Publishing Venue

IBM

Related People

Morgan, WM: AUTHOR

Abstract

When etching through resist 1 (Fig. 1), metal adjacent the resist etches up to 1.3 times faster than the remainder. This presents the problem of edge break-through, as at 2, when a thin metal sheet 3, to be used, for example, as a mask, is the workpiece.

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Preventing Edge Break Through

When etching through resist 1 (Fig. 1), metal adjacent the resist etches up to
1.3 times faster than the remainder. This presents the problem of edge break- through, as at 2, when a thin metal sheet 3, to be used, for example, as a mask, is the workpiece.

The problem is solved by the use of a frame 4 with reverse chamfered edges 5 arranged as shown in Fig. 2. The frame 4 prevents the etchant from directly spraying onto the edge of the etched region, as shown by the arrows. By suitable choice of dimensions of the chamfer 5 a positive tapered edge 6 can be given to the thinned region.

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