Browse Prior Art Database

Stopping Means for Handling and Controlling Semiconductor Wafers in an Automated Line System

IP.com Disclosure Number: IPCOM000087686D
Original Publication Date: 1977-Mar-01
Included in the Prior Art Database: 2005-Mar-03
Document File: 3 page(s) / 79K

Publishing Venue

IBM

Related People

Raacke, KH: AUTHOR [+2]

Abstract

This describes an automatic shuttle valve which is used for stopping a rapidly moving wafer on a Bernoulli-effect air track. Large semiconductor wafers can be moved by utilizing positive air pressure tracks. These wafers move on such tracks at relatively high speeds, and at various processing points it is necessary to stop the wafer and maintain it in that position without causing chipping or damage to the wafer as it stops.

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Stopping Means for Handling and Controlling Semiconductor Wafers in an Automated Line System

This describes an automatic shuttle valve which is used for stopping a rapidly moving wafer on a Bernoulli-effect air track. Large semiconductor wafers can be moved by utilizing positive air pressure tracks. These wafers move on such tracks at relatively high speeds, and at various processing points it is necessary to stop the wafer and maintain it in that position without causing chipping or damage to the wafer as it stops.

The present apparatus provides such a stopping mechanism. The wafer 10 is moved along the track 11 in the direction shown in Fig. 1 and is supported above the surface of the track 11 by an air flow through a multiplicity of air ports 12 in the track. This moving wafer 10 can be stopped by vacuum stops 13 and
14. Fig. 2 shows a cross section of the vacuum stop 13, which comprises a hollow set screw 15 set in the bed of the track 11 so its upper surface is flush with the upper surface of the air track 11 in which is disposed a slidable member
20. This slidable member 20 has a hollow core 21 and a large flat extensive head 22 with a peripheral lip 23.

This vacuum stop operates as follows: Suitable vacuum means (not shown) are coupled to the lower portion of the set screw. Air, from the surface of the air slide, is drawn down through the hollow central core 21 of the slidable member
20. When the wafer passes over the surface of the member 20, the action of the air being drawn into the hollow core 21 of the member 20 causes lifting of the member 20 through aerodynamic action, as shown in Fig. 3, to occur. This lifting causes the slidable member 20 to rise up out of the air track bed towards the wafer 10 which is being supported and maintained a fixed distance d above the surface of the air track 11 by the air passing out of the ports 12 in the air track. Sim...