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Grooved Tips with Independent Wire Guide

IP.com Disclosure Number: IPCOM000087694D
Original Publication Date: 1977-Mar-01
Included in the Prior Art Database: 2005-Mar-03
Document File: 2 page(s) / 29K

Publishing Venue

IBM

Related People

Funari, J: AUTHOR [+2]

Abstract

As shown, wire-bonding tips are provided with a groove which fits across the diameter of the wire which enables bonding on printed-circuit pads of a size equal to the diameter of the wire. As a result, smaller pad sizes may be bonded. Also, the use of the groove results in more accurate location of the wire. The insulation thickness controls what diameter of wire can be bonded, and the diameter of the wire and the width of the tips controls the pad size.

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Grooved Tips with Independent Wire Guide

As shown, wire-bonding tips are provided with a groove which fits across the diameter of the wire which enables bonding on printed-circuit pads of a size equal to the diameter of the wire. As a result, smaller pad sizes may be bonded. Also, the use of the groove results in more accurate location of the wire. The insulation thickness controls what diameter of wire can be bonded, and the diameter of the wire and the width of the tips controls the pad size.

The use of an independent wire guide behind the tips results in the wire being guided more precisely to the tips and enables the use of a greater tip geometry.

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