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Temperature Exchange for Electrical and Mechanical Components

IP.com Disclosure Number: IPCOM000087737D
Original Publication Date: 1977-Mar-01
Included in the Prior Art Database: 2005-Mar-03
Document File: 3 page(s) / 57K

Publishing Venue

IBM

Related People

Dierl, B: AUTHOR [+3]

Abstract

To cool irregularly shaped mechanical or electrical components, a porous structure is used. This structure is in thermally conductive contact with the surface to be cooled, is sealed on the outside by a covering layer, and passed by a cooling medium. The porous structure is molded from a self-hardening compound consisting of granulated metal mixed with epoxide resin. The compound and the surface of the component to be cooled are contacted either directly or via a thermally conductive base layer. Pipes serving as connectors and carrying the cooling medium, e.g., water, are embedded in the compound. Hardening of the compound is effected at minimum heat dissipation, so that the thermal stresses to which the component is subjected remain low.

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Temperature Exchange for Electrical and Mechanical Components

To cool irregularly shaped mechanical or electrical components, a porous structure is used. This structure is in thermally conductive contact with the surface to be cooled, is sealed on the outside by a covering layer, and passed by a cooling medium. The porous structure is molded from a self-hardening compound consisting of granulated metal mixed with epoxide resin. The compound and the surface of the component to be cooled are contacted either directly or via a thermally conductive base layer. Pipes serving as connectors and carrying the cooling medium, e.g., water, are embedded in the compound. Hardening of the compound is effected at minimum heat dissipation, so that the thermal stresses to which the component is subjected remain low. After hardening, the resultant porous structure is sealed by a synthetic resin covering layer.

The arrangement is inserted into a cooling circuit by means of the connectors. The porous structure absorbs the temperature of the component, releasing it to the cooling medium. The porous structure leads to a considerable increase in the heat transfer area, so that an effective eat exchange with the cooling medium passing the porous structure is ensured, while maintaining the component at the predetermined temperature value.

The cooling system described can be used for a multitude of applications. It is particularly suitable for temperature-sensitive electrical components, such as integrated semiconductor circuits, power transistors, transformers, coils, resistors, and the like. Fig. 1 shows a cooling system for a rectifier 3 which is surrounded by a thermally conductive housing 4. A compound 5 of aluminum granules and epoxide resin with a hardener is applied to housing 4, the electrical connectors 6 of the rectifier protruding to the outside. The resin hardener/aluminum granule ra...