Browse Prior Art Database

Metal LSI Chip Carrier With Via Through Pins

IP.com Disclosure Number: IPCOM000087822D
Original Publication Date: 1977-Mar-01
Included in the Prior Art Database: 2005-Mar-03
Document File: 2 page(s) / 36K

Publishing Venue

IBM

Related People

Brownlow, JM: AUTHOR [+3]

Abstract

A metal large scale integration (LSI) chip carrier package with via through pins can be fabricated, as shown in the figure, by retaining molybdenum (moly) via through pins with polyimide and ceramic mechanical support washers in a molybdenum substrate.

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Metal LSI Chip Carrier With Via Through Pins

A metal large scale integration (LSI) chip carrier package with via through pins can be fabricated, as shown in the figure, by retaining molybdenum (moly) via through pins with polyimide and ceramic mechanical support washers in a molybdenum substrate.

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