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Low Stress Conductors for Magnetic Bubble Devices

IP.com Disclosure Number: IPCOM000087855D
Original Publication Date: 1977-Mar-01
Included in the Prior Art Database: 2005-Mar-03
Document File: 1 page(s) / 11K

Publishing Venue

IBM

Related People

Ahn, KY: AUTHOR [+3]

Abstract

Gold conductors are often used as overlayers in magnetic bubble domain devices. However, stresses occur in these conductors which affect device performance. In order to reduce these stresses, a composite spacer layer is proposed for use between the bubble domain film and the overlying gold conductors.

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Low Stress Conductors for Magnetic Bubble Devices

Gold conductors are often used as overlayers in magnetic bubble domain devices. However, stresses occur in these conductors which affect device performance. In order to reduce these stresses, a composite spacer layer is proposed for use between the bubble domain film and the overlying gold conductors.

This composite spacer is provided from a plurality of individual layers. The first layer is a glass, e.g., EE-9, located over the bubble domain film, on which is deposited a plating base, such as Ti/Cu or Ti/Au. Gold is electroplated over the plating base layer, using a gold bath, such as the Sel-Rex BDT-510 bath. Plating can occur at room temperatures, and the deposited gold conductors will yield low stress levels even in thick gold conductors.

The glass layer has a typical thickness of about 2500 angstroms, while the plating base layer of either Ti/Cu or Ti/Au has a thickness of about 200 angstroms/ 400 angstroms. The plated gold conductors are typically about 5000 angstroms thick.

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