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Activation Process for Electroless Nickel Baths

IP.com Disclosure Number: IPCOM000088028D
Original Publication Date: 1977-Apr-01
Included in the Prior Art Database: 2005-Mar-04
Document File: 1 page(s) / 12K

Publishing Venue

IBM

Related People

Haddad, MM: AUTHOR

Abstract

In using electroless metal plating baths there is frequently encountered an initial response time that varies with the bath and the article being plated. The response of an electroless metal placing bath is that time period that elapses between the time the object is placed in the bath and the onset of the metal plating. This irregularity of response can vary widely in different baths, thus causing wide variation and discrepancy in plating thickness and coverage.

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Activation Process for Electroless Nickel Baths

In using electroless metal plating baths there is frequently encountered an initial response time that varies with the bath and the article being plated. The response of an electroless metal placing bath is that time period that elapses between the time the object is placed in the bath and the onset of the metal plating. This irregularity of response can vary widely in different baths, thus causing wide variation and discrepancy in plating thickness and coverage.

In the fabrication of multilayer ceramic substrate semiconductor packages, it may be desirable to deposit a nickel layer on specific areas of the substrate as a part of the metallurgy system. These ceramic substrates are presensitized by dipping into a palladium-chloride solution and then rinsing. Differences in response time of various nickel plating baths create significant processing problems.

In this method of activating electroless baths, presensitized beryllium-copper panels are immersed in the plating bath for approximately 15 minutes. The exact plate size and time are governed by the volume of the solution and should be sufficient to provide 36 square inches per 7 liters of bath. The plates can also be unsensitized copper, beryllium-copper, nickel, nickel-plated plates, cobalt or any other catalytic material which can be used to provide bath activation. Upon completion of the activation, the metallic bath will respond immediately to plating when sui...