Browse Prior Art Database

Decoupling Capacitor Mounting

IP.com Disclosure Number: IPCOM000088034D
Original Publication Date: 1977-Apr-01
Included in the Prior Art Database: 2005-Mar-04
Document File: 2 page(s) / 54K

Publishing Venue

IBM

Related People

Crowder, G: AUTHOR [+3]

Abstract

This is an improved technique for decoupling high frequency noise in semiconductor circuit packages.

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Decoupling Capacitor Mounting

This is an improved technique for decoupling high frequency noise in semiconductor circuit packages.

Decoupling capacitors can be attached to a mounting frame (Fig. 1). The frame includes a support base 10 and sidewalls 12 and 14. A portion of base 10 is a nonconducting material in order to insulate the remainder of the support base and sidewalls, which are metallic, from each other. Conductive pins 20, 22, 24 and 26 are fixedly attached to support base 10 and are adapted to be plugged into a mounting socket on a printed-circuit card or board, for example. Capacitors are stacked within the mounting frame, as shown by dotted lines 30 and 32. One of the capacitor leads contacts sidewall 12 while the other contacts sidewall 14. Preferably, low inductance, nonpolarized, ceramic capacitors are used. This provides optimum high frequency decoupling and avoids problems associated with polarized capacitors die to inadvertent reversal of leads.

A plurality of decoupling capacitors are stackable, as illustrated in the side view of Fig. 2. The support base 10' again has a nonconductive portion 10A for purposes of insulation. The sidewalls 12' and 14' are metallic side clips into which the capacitors 30' and 32' are inserted. This stacking feature permits the addition or removal of capacitors, even in the field. Pins 20' and 26' again form the means for attaching the decoupling capacitor module to a printed-circuit card or board.

As illustrated i...