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Browse Prior Art Database

Semiconductor Package Structure

IP.com Disclosure Number: IPCOM000088036D
Original Publication Date: 1977-Apr-01
Included in the Prior Art Database: 2005-Mar-04
Document File: 2 page(s) / 38K

Publishing Venue

IBM

Related People

Ecker, ME: AUTHOR [+2]

Abstract

In semiconductor package assemblies, particularly packaging structures associated with high speed operation, the electrical characteristics of the structure assumes increased importance. For example, impedance of the package should be matched to the supporting board. A limiting factor in obtaining this matching of impedances is the material of the wiring support elements and the geometry of the wiring itself. In order to increase the impedance of the overall package assembly, it is desirable to obtain a material having a relatively low dielectric constant. Ceramic materials, such as alumina, have relatively high dielectric constants on the order of 9.4.

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Semiconductor Package Structure

In semiconductor package assemblies, particularly packaging structures associated with high speed operation, the electrical characteristics of the structure assumes increased importance. For example, impedance of the package should be matched to the supporting board. A limiting factor in obtaining this matching of impedances is the material of the wiring support elements and the geometry of the wiring itself. In order to increase the impedance of the overall package assembly, it is desirable to obtain a material having a relatively low dielectric constant. Ceramic materials, such as alumina, have relatively high dielectric constants on the order of 9.4.

A package structure for utilizing the concept of this disclosure typically had a plurality of substrates 10, 12 and 14, one or more integrated semiconductor devices 16 supported on substrate 14, and joined electrically with solder joints 18 and pins 20 for making electrical contact to a board or other support, and a can 22 enclosing the substrate and suitably sealed. In this package the substrates 10, and 14 are formed of a mixture of ceramic and organic polymer resin material. The combination of the ceramic and the resin material results in a dielectric constant which is the average of the dielectric constants of the two materials and thus significantly less than the more conventional package utilizing a ceramic substrate with a dielectric constant on the order of 9.4. A typical ma...