Browse Prior Art Database

Unloading Tool for Wafers in Back To Back Processing

IP.com Disclosure Number: IPCOM000088040D
Original Publication Date: 1977-Apr-01
Included in the Prior Art Database: 2005-Mar-04
Document File: 2 page(s) / 40K

Publishing Venue

IBM

Related People

Clark, HA: AUTHOR [+3]

Abstract

Shown is a tool which allows removal of wafers by combining a vacuum pencil with a source of pressurized air or M2. This is done in a single operation.

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Unloading Tool for Wafers in Back To Back Processing

Shown is a tool which allows removal of wafers by combining a vacuum pencil with a source of pressurized air or M2. This is done in a single operation.

A fine stream of gas 1 is directed against the edge of the wafers 2, forcing them apart and allowing the insertion of the vacuum pencil 3 between the wafers. (When the vacuum probe is inserted to the desired depth, vacuum is turned on and the wafer is withdrawn from rack 4.

An air supply (e.g., 5-10 lb.) is continuously on. The vacuum is controlled by placing a finger over hole 5 (touch valve) in the vacuum supply.

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