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Browse Prior Art Database

Lead Indium Solder Joint Analysis

IP.com Disclosure Number: IPCOM000088084D
Original Publication Date: 1977-Apr-01
Included in the Prior Art Database: 2005-Mar-04
Document File: 1 page(s) / 11K

Publishing Venue

IBM

Related People

Hufault, AD: AUTHOR [+2]

Abstract

PbIn solder is used in the manufacture of circuit modules. Excessive solder flow can result in protrusions which could cause shorts in the module. Insufficient solder flow or corrosion can result in inadequate solder joints.

This text was extracted from a PDF file.
This is the abbreviated version, containing approximately 100% of the total text.

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Lead Indium Solder Joint Analysis

PbIn solder is used in the manufacture of circuit modules.

Excessive solder flow can result in protrusions which could cause shorts in the module. Insufficient solder flow or corrosion can result in inadequate solder joints.

Excessive solder flow, insufficient solder flow and corrosion can all be detected using nondestructive X-ray radiographic techniques. A microfocus X- ray unit can be utilized to produce a photographic image of the solder joint on an appropriate film, e.g., a Polaroid film. Although exposure time will be affected by the nature and thickness of the material on which the solder joint is utilized, it will generally be about 30 minutes.

Visual analysis of the X-ray topograph will show protrusions resulting from excessive solder flow and voids resulting from insufficient solder flow or from corrosion.

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