Browse Prior Art Database

Multilayer Electronic Package

IP.com Disclosure Number: IPCOM000088177D
Original Publication Date: 1977-May-01
Included in the Prior Art Database: 2005-Mar-04
Document File: 2 page(s) / 52K

Publishing Venue

IBM

Related People

Flaherty, RJ: AUTHOR [+2]

Abstract

The cards 1,2 of different sizes and boards 3, with modules or components 4 attached, are mounted to the bracket 5 spaced from each other to allow air flow 6 for cooling.

This text was extracted from a PDF file.
At least one non-text object (such as an image or picture) has been suppressed.
This is the abbreviated version, containing approximately 100% of the total text.

Page 1 of 2

Multilayer Electronic Package

The cards 1,2 of different sizes and boards 3, with modules or components 4 attached, are mounted to the bracket 5 spaced from each other to allow air flow 6 for cooling.

Electrical interconnection for power and signal distribution between the cards 1,2 and the boards 3 is accomplished by the crossovers 7,8 on the front and rear sides of the package. The crossovers 7,8 are small cards with technology similar to that used for the cards 1,2 and the boards 3, thus equalizing impedance. The small crossovers 7 interconnect two layers, while the large crossovers 8 interconnect all four layers. Either crossover 7,8 may contain or be replaced by a cable connector 9.

The crossovers 7,8 and cable connectors 9 close the front and rear sides of the package and form a plenum for the cooling air flow 6.

1

Page 2 of 2

2

[This page contains 2 pictures or other non-text objects]