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Strip Load Tool for Diamond Diced Wafers

IP.com Disclosure Number: IPCOM000088204D
Original Publication Date: 1977-May-01
Included in the Prior Art Database: 2005-Mar-04
Document File: 1 page(s) / 12K

Publishing Venue

IBM

Related People

Corriea, GC: AUTHOR [+2]

Abstract

By mounting semiconductor wafers on a flexible tape and dicing these wafers with a diamond blade that cuts through the entire thickness of the wafer and partly into the tape which can then be peeled, a significant increase in throughput and production of diced wafers can be achieved.

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Strip Load Tool for Diamond Diced Wafers

By mounting semiconductor wafers on a flexible tape and dicing these wafers with a diamond blade that cuts through the entire thickness of the wafer and partly into the tape which can then be peeled, a significant increase in throughput and production of diced wafers can be achieved.

The entire process is as follows: A silicon semiconductor wafer, previously formed with integrated circuits therein and ready for dicing, is mounted on a low tack adhesive tape. The wafer mounted on the tape is then placed in a diamond dicing machine and sawed into individual dice each of which contains a single integrated circuit. By carefully adjusting the diamond dicing blade in relation to the mounted wafer, the blade is made to pass entirely through the thickness of the wafer and into the tape approximately 0.001 inch. This dicing operation separates the wafer into individual chips, but the tape keeps each of the now separated chips in its original orientation with respect to all the other chips.

The diced wafer, still mounted on the tape, is then aligned by the wafer notch or other suitable means to a fixed position on a vacuum strip tool which is designed to hold only the chips that are to be tested or otherwise handled further. This vacuum strip tool will not hold the periphery material or regions on the wafer which are to be discarded. Once the diced wafer is aligned with the vacuum strip tool, a suitable vacuum is applied to hold eac...