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Hybrid Module Including Thin Film Conductors and Paste Resistors

IP.com Disclosure Number: IPCOM000088208D
Original Publication Date: 1977-May-01
Included in the Prior Art Database: 2005-Mar-04
Document File: 1 page(s) / 12K

Publishing Venue

IBM

Related People

VanVestrout, VD: AUTHOR

Abstract

There are two widely used technologies for making conductive lines on integrated-circuit modules. One of these technologies utilizes a silverpalladium paste which is screened onto the modules. Conductors made utilizing this technology are generally relatively thick. The screening technology can also be used to fabricate resistors on modules. It has been conventional to fabricate modules which include screened resistors and screened conductors.

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Hybrid Module Including Thin Film Conductors and Paste Resistors

There are two widely used technologies for making conductive lines on integrated-circuit modules. One of these technologies utilizes a silverpalladium paste which is screened onto the modules. Conductors made utilizing this technology are generally relatively thick. The screening technology can also be used to fabricate resistors on modules. It has been conventional to fabricate modules which include screened resistors and screened conductors.

The second widely used technology for fabricating integrated circuit modules involves evaporating thin-film conductors onto the modules. This is generally termed "metalized ceramic". The metalized ceramic modules which are in general use do not include resistors. If resistors are required for such circuitry, they are provided utilizing either discrete components or separate modules.

Utilizing the following process, it is possible to fabricate thin-film metalized ceramic circuitry on the top side of a ceramic substrate and thick-film conductive circuitry which includes resistors on the bottom side of the ceramic module. The sequence used is as follows: 1. Screen, dry, and fire paste on bottom side of module. 2. Clean both sides of the module. 3. Dry the module. 4. Vacuum deposit chrome, copper, chrome on top side of module. 5. Spray KTFR* photoresist on top side of module. 6. Spray KTFR photoresist on bottom side of module. 7. Expose pattern on top side of modu...