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Browse Prior Art Database

Reworkable Module Cap

IP.com Disclosure Number: IPCOM000088212D
Original Publication Date: 1977-May-01
Included in the Prior Art Database: 2005-Mar-04
Document File: 1 page(s) / 11K

Publishing Venue

IBM

Related People

Chirino, OI: AUTHOR [+2]

Abstract

Quite often during system bring-up or similar situations, it is desirable to be able to remove caps from circuit modules, for example, to permit testing, engineering changes or modifications of the module. During these situations, it is preferable that the changes be done while the module is still on the card without exposing the circuitry to additional processing parameters, such as heat, solvents and fluxes.

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Reworkable Module Cap

Quite often during system bring-up or similar situations, it is desirable to be able to remove caps from circuit modules, for example, to permit testing, engineering changes or modifications of the module. During these situations, it is preferable that the changes be done while the module is still on the card without exposing the circuitry to additional processing parameters, such as heat, solvents and fluxes.

A solution to this problem is to provide a temporary seal by means of a two-sided tape, one side sticking to the periphery of the cap while the other sticks to the substrate. Preforms can be easily cut, or punched out, from bulk material. Using this technique, once the module is mounted to the card, the cap is easily removed to permit testing, modification, or other change to its inner circuitry.

Such a reworkable cap could also be used as a means of interplant shipping of modules to allow testing or other applications prior to attaching the module to cards.

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