Browse Prior Art Database

Temporary Module Patch Assembly

IP.com Disclosure Number: IPCOM000088218D
Original Publication Date: 1977-May-01
Included in the Prior Art Database: 2005-Mar-04
Document File: 2 page(s) / 45K

Publishing Venue

IBM

Related People

Kershaw, JF: AUTHOR

Abstract

Assembly 10 provides temporary and intermediate connection between a plug-compatible panel (not shown) or the like and external discrete circuitry (not shown).

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Temporary Module Patch Assembly

Assembly 10 provides temporary and intermediate connection between a plug-compatible panel (not shown) or the like and external discrete circuitry (not shown).

Basically, assembly 10 includes a ceramic substrate 11 with a universal or predetermined pattern of multiple pins 12 having lower ends 12L which are pluggable into the panel. To the upper slotted ends 12U of pins 12 are bonded discrete wires, e.g., wires 13, which are connected to the external circuitry. The substrate is mounted in a rectangular plastic ring 14 which has protrusions 15 to which the wires 13 may be strapped by straps 16 to relieve the strain at the bond. The other ends (not shown) of the wire 13 are terminated in a suitable connector which is mated to another connecter to which the external circuitry is connected. Alternately, the wires 13 may be part of a flexible multiple conductor flat cable.

In one application, the interconnection assembly 10, with the associated external circuit, is used in the field to temporarily replace a defective integrated- circuit module chip until a replacement chip can be obtained. In another application, it is used to provide flexibility in the designing of new chip circuitry by using discrete macrocircuit parts in the external circuitry without the necessity of first fabricating the chip module which will incorporate the ultimate circuit design to be incorporated in the chip.

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