Browse Prior Art Database

Thermal Conduction Button

IP.com Disclosure Number: IPCOM000088248D
Original Publication Date: 1977-May-01
Included in the Prior Art Database: 2005-Mar-04
Document File: 2 page(s) / 42K

Publishing Venue

IBM

Related People

Kammerer, HC: AUTHOR

Abstract

Enhanced thermal conduction (cooling) is provided between a heat source and sink, such as a substrate-mounted chip and a cold plate.

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Thermal Conduction Button

Enhanced thermal conduction (cooling) is provided between a heat source and sink, such as a substrate-mounted chip and a cold plate.

The thermal conduction medium between the chip 10 and the heat sink 12 consists of a thermal button 14 having mating circular members 16, 18 of either copper or aluminum. The exact dimensions of the parts 16, 18 of the button 14 are based on the thermal design and size constraints. Referring to the figure, it can be seen that the parts of the button are designed so that approximately one half of the cross-sectional area is contained in each part to give equal conduction area. The interface area between the parts is maximized to enhance the heat flow through the gap. The button 14 is within a cylindrical hole 20 in the heat sink 12 which is filled with helium gas 22 to improve the heat transfer. A spring 24 is located within the assembly to exert pressure (axial) in both outward directions. A damping medium 26 is located within the inner most circular area to improve the vibration characteristics. The ends of the assembly are coated with indium 28 to improve the surface mating with the heat source chip 10 and heat sink 12.

The use of the indium 28 plus the loading by the spring 24 permits gap stability by achieving and maintaining a close spacing between the assembly and the chip 10. The above-described thermal conduction button 14 can be used singly or in multiple arrays depending on the number of chips to...