Browse Prior Art Database

Thin Film Patterning Technique for Ceramic Parts

IP.com Disclosure Number: IPCOM000088307D
Original Publication Date: 1977-May-01
Included in the Prior Art Database: 2005-Mar-04
Document File: 1 page(s) / 11K

Publishing Venue

IBM

Related People

Dahlstrom, MS: AUTHOR [+2]

Abstract

An additive metallization process for ceramic substrates is described.

This text was extracted from a PDF file.
This is the abbreviated version, containing approximately 100% of the total text.

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Thin Film Patterning Technique for Ceramic Parts

An additive metallization process for ceramic substrates is described.

A soluble paste is used to produce a negative image of the desired metallization pattern on the substrate. A conductive material is vacuum- deposited or sputtered over the entire substrate surface. The substrate is then immersed in a suitable solvent for the paste. The paste dissolves, taking with it the metal which was over it; the result is metal in the desired pattern.

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