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Screenable Water Soluble Solder Mask

IP.com Disclosure Number: IPCOM000088391D
Original Publication Date: 1977-Jun-01
Included in the Prior Art Database: 2005-Mar-04
Document File: 1 page(s) / 11K

Publishing Venue

IBM

Related People

Ameen, JG: AUTHOR [+3]

Abstract

A water-soluble solder mask which can be screened onto a metallized ceramic substrate can be formulated as follows: 1. Add 35cc's of water to 4.5g of CAB-O-SIL* and stir to consistency. 2. Next, add 14g of Na5P3OlO (sodium phosphate, tripoly). 3. Heat on low heat, and stir for approximately 10 minutes. A uniform paste results which can be screened onto substrates. 4. After screening onto a substrate, bake the module for 2 minutes at 140 Degrees C. 5. Tin the circuit lines. 6. Strip the solder mask by immersion in boiling water for 3 minutes.

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Screenable Water Soluble Solder Mask

A water-soluble solder mask which can be screened onto a metallized ceramic substrate can be formulated as follows:
1. Add 35cc's of water to 4.5g of CAB-O-SIL*

and stir to consistency.
2. Next, add 14g of Na5P3OlO (sodium phosphate, tripoly).
3. Heat on low heat, and stir for approximately 10 minutes. A uniform paste results which can be screened onto substrates.
4. After screening onto a substrate, bake the module for 2 minutes at 140 Degrees C.
5. Tin the circuit lines.
6. Strip the solder mask by immersion in

boiling water for 3 minutes.

The above-described material has the advantage of being strippable after tinning.

Increases in throughput can be obtained when the above-described water- soluble solder mask is used together with water-soluble fluxes. * Trademark of Cabot Corporation.

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