Browse Prior Art Database

Solder Reservoir for Chip Thermal Connection

IP.com Disclosure Number: IPCOM000088424D
Original Publication Date: 1977-Jun-01
Included in the Prior Art Database: 2005-Mar-04
Document File: 2 page(s) / 26K

Publishing Venue

IBM

Related People

Corso, JA: AUTHOR [+4]

Abstract

The figure shows a package which will remove heat from the back of a contacts-down mounted semiconductor chip 10 on a substrate via solder 12 to cover 13 which may, in turn, have an air of liquid heat sink (not shown). The cover 13 has an indentation 14 over the location of the chip. Solder is made to fill portions 15 of the cover around the indentation as well as a coating on the indentation. The solder in portions 15 of the cover acts as a well or reservoir for solder during the solder reflow which results in the structure shown. The method allows more efficient design of the joint between the chip 10 and cover 13 by minimizing solder thickness to dimensional tolerances achievable via fabrication techniques. Minimum solder thickness reduces thermal resistance chip to cover.

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Solder Reservoir for Chip Thermal Connection

The figure shows a package which will remove heat from the back of a contacts-down mounted semiconductor chip 10 on a substrate via solder 12 to cover 13 which may, in turn, have an air of liquid heat sink (not shown). The cover 13 has an indentation 14 over the location of the chip. Solder is made to fill portions 15 of the cover around the indentation as well as a coating on the indentation.

The solder in portions 15 of the cover acts as a well or reservoir for solder during the solder reflow which results in the structure shown. The method allows more efficient design of the joint between the chip 10 and cover 13 by minimizing solder thickness to dimensional tolerances achievable via fabrication techniques. Minimum solder thickness reduces thermal resistance chip to cover.

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