Browse Prior Art Database

Cooling Assembly for Integrated Circuit Chip

IP.com Disclosure Number: IPCOM000088425D
Original Publication Date: 1977-Jun-01
Included in the Prior Art Database: 2005-Mar-04
Document File: 2 page(s) / 39K

Publishing Venue

IBM

Related People

Lynch, JR: AUTHOR [+2]

Abstract

In high-density, large-scale integrated circuits, heat dissipation is a significant problem. The present structure provides a method for extensive heat dissipation, piston 2 having a substantial mass urged against the surface of integrated-circuit chip 7 by spring 8. Thus, piston 2 serves as a heat sink for dissipating the heat generated at chip 7. In addition, a further heat sink 1 is provided by a mass of solid, low-expansion multiple material, such as molybdenum or beryllium oxide, surrounding the spring and piston. Surface 3 between mass 1 and ceramic substrate 9 is hermetically sealed. Rod 4, which is a continuation of mass member 1, is in positive contact with fluid-filled cold plate 10. Heat dissipation mass 1 has extensive contact with cold plate 10 at interface 6.

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Cooling Assembly for Integrated Circuit Chip

In high-density, large-scale integrated circuits, heat dissipation is a significant problem. The present structure provides a method for extensive heat dissipation, piston 2 having a substantial mass urged against the surface of integrated-circuit chip 7 by spring 8. Thus, piston 2 serves as a heat sink for dissipating the heat generated at chip 7. In addition, a further heat sink 1 is provided by a mass of solid, low-expansion multiple material, such as molybdenum or beryllium oxide, surrounding the spring and piston. Surface 3 between mass 1 and ceramic substrate 9 is hermetically sealed. Rod 4, which is a continuation of mass member 1, is in positive contact with fluid-filled cold plate
10. Heat dissipation mass 1 has extensive contact with cold plate 10 at interface
6. In addition, to provide for further cooling, the hermetically sealed space 11 may be filled with a material, such as helium, to provide optimum heat transfer. Also, interface 6 may be helium-coated or filled with thermal grease or silicone to optimize such heat transfer.

The structure provides a low-cost assembly for maximum cooling of the hermetically sealed integrated-circuit chip.

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