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Discrete Wire Shield Frame for Semiconductor Chip Packaging Structure

IP.com Disclosure Number: IPCOM000088429D
Original Publication Date: 1977-Jun-01
Included in the Prior Art Database: 2005-Mar-04
Document File: 2 page(s) / 39K

Publishing Venue

IBM

Related People

Crowder, G: AUTHOR [+2]

Abstract

In semiconductor chip packaging structures use of a shield frame 12, as generally depicted in the drawing, reduces coupled noise inherent in discrete interconnection wiring. In particular, the use of the shield frame facilitates control of the characteristic impedance of the wires 4 that are remote from the reference plane 10. The shield frame may also act as a baffle when used in a liquid cooling environment.

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Discrete Wire Shield Frame for Semiconductor Chip Packaging Structure

In semiconductor chip packaging structures use of a shield frame 12, as generally depicted in the drawing, reduces coupled noise inherent in discrete interconnection wiring. In particular, the use of the shield frame facilitates control of the characteristic impedance of the wires 4 that are remote from the reference plane 10.

The shield frame may also act as a baffle when used in a liquid cooling environment.

When interconnections are made by means of discrete wires 4, the resulting impedance is largely determined by their height above the ground plane 10 and the thickness of the insulation layer 15. Discrete wires 4 have a lower impedance and coupling coefficient when the shield frame 12 is in close proximity to the wire groups.

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