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Undershoot Clamp Diodes

IP.com Disclosure Number: IPCOM000088449D
Original Publication Date: 1977-Jun-01
Included in the Prior Art Database: 2005-Mar-04
Document File: 2 page(s) / 40K

Publishing Venue

IBM

Related People

Carpenter, LC: AUTHOR [+4]

Abstract

To minimize transmission line reflections with high speed circuits, undershoot diode clamps are desirable. A diode may be placed under the power bus between internal cells without requiring another cell position.

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Undershoot Clamp Diodes

To minimize transmission line reflections with high speed circuits, undershoot diode clamps are desirable. A diode may be placed under the power bus between internal cells without requiring another cell position.

This article relates to the concept of placing undershoot diodes in the silicon under the existing second level power bussing which, as depicted, runs horizontally across the chip. The anode contact is grounded. By means of contact hole personality, desired cathode contacts may be provided along a reach through diffusion region. The cathode contacts are aligned with the first level wiring channel grid. It will be apparent that global wiring of undershoot diodes to off-chip receive circuits may be readily accomplished by this technique.

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