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Circuit Module

IP.com Disclosure Number: IPCOM000088488D
Original Publication Date: 1977-Jun-01
Included in the Prior Art Database: 2005-Mar-04
Document File: 2 page(s) / 45K

Publishing Venue

IBM

Related People

DiGiacomo, G: AUTHOR

Abstract

Fig. 1 is a top view and Fig. 2 is a side view showing a conventional circuit module having a ceramic substrate 2 and a semiconductor chip 3 that is mounted on the substrate by means of solder balls 4. These components are mounted in an enclosure (not shown) containing a fluorocarbon for cooling.

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Circuit Module

Fig. 1 is a top view and Fig. 2 is a side view showing a conventional circuit module having a ceramic substrate 2 and a semiconductor chip 3 that is mounted on the substrate by means of solder balls 4. These components are mounted in an enclosure (not shown) containing a fluorocarbon for cooling.

The module of the drawing includes a conductive mesh 5 that may be formed of anodized aluminum and is spaced outwardly from chip 3 by means of conductive posts 6. Posts 6 are electrically connected to a point that is positive with respect to ground by about five volts. The apparatus establishes an electrical gradient of about 500 volts per centimeter or greater.

Any chemically active species such as C1-, F-, S- and CH(3)COO-blunt angle electrically attracted to the positive mesh in preference to other components of the module. The chemically active species may be held in the mesh or they may be oxidized to form a gas that is removed by a harmless reaction with the metal enclosure.

A similar effect can be achieved for forming two conductive borders on substrate 2 just outside the position of solder balls 4 and connecting the borders to have differing voltages on the order of 40 to 50 volts. The conductive borders may be formed of molybdenum paste that is covered with a thin layer of nickel and a layer of gold. Chemically active species will be collected between and outside the two borders.

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