Browse Prior Art Database

High Temperature Solder Mask

IP.com Disclosure Number: IPCOM000088617D
Original Publication Date: 1977-Jul-01
Included in the Prior Art Database: 2005-Mar-04
Document File: 1 page(s) / 11K

Publishing Venue

IBM

Related People

Funari, J: AUTHOR [+3]

Abstract

In fabricating hybrid electronic modules, it is sometimes necessary to have gold-bonding pads on a module surface which must be tinned by dip coating with a 10/90 solder. In order to protect the gold-bonding pads, a solder mask must be applied.

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High Temperature Solder Mask

In fabricating hybrid electronic modules, it is sometimes necessary to have gold-bonding pads on a module surface which must be tinned by dip coating with a 10/90 solder. In order to protect the gold-bonding pads, a solder mask must be applied.

It has been found that a silicone rubber adhesive sealant (Dow Corning's 732RTV) works satisfactorily. The silicone can be applied to the gold-bonding pads in a conventional manner by a brush or dispensing screen.

The module is then placed in water for a short period of time (for example, 1 minute). After being removed from the water, the module is air-dried for a few minutes (for example, 5 to 10 minutes). The module is then fluxed and run through a normal dip-tinning process. After tinning, the residual flux and the solder mask are removed by a chlorinated solvent, such as trichloroethylene.

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