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Solder Aging 10/90 Tin Lead Solder

IP.com Disclosure Number: IPCOM000088619D
Original Publication Date: 1977-Jul-01
Included in the Prior Art Database: 2005-Mar-04
Document File: 1 page(s) / 11K

Publishing Venue

IBM

Related People

Thomas, GM: AUTHOR

Abstract

When metalized ceramic substrates are immersed in a pot of new (fresh) solder, the solder attacks and damages the top layer of chrome metallurgy. It has been discovered that the damage to the top layer of chrome metallurgy can be eliminated by aging the solder prior to the time that the metalized ceramic substrates are immersed therein.

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Solder Aging 10/90 Tin Lead Solder

When metalized ceramic substrates are immersed in a pot of new (fresh) solder, the solder attacks and damages the top layer of chrome metallurgy. It has been discovered that the damage to the top layer of chrome metallurgy can be eliminated by aging the solder prior to the time that the metalized ceramic substrates are immersed therein.

This aging process has been found to be especially beneficial with respect to 10/90 tin lead solder.

The solder can be aged by melting new solder in a solder pot that contains a wave-solder mechanism. The molten solder is subjected to the wave-solder action or agitation for two to three hours.

The solder can also be aged by melting the solder and maintaining the melt for 48 to 72 hours without agitation.

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