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Bow Tie Heat Sink

IP.com Disclosure Number: IPCOM000088628D
Original Publication Date: 1977-Jul-01
Included in the Prior Art Database: 2005-Mar-04
Document File: 2 page(s) / 38K

Publishing Venue

IBM

Related People

Shott, FA: AUTHOR

Abstract

A bow-tie heat sink provides a low profile, extended surface heat sink to be used on electronic component modules to increase their thermal dissipation capabilities. The design, as shown above, maximizes air convection cooling surface area for a given module size and component height. This heat sink can be mechanically attached to a module such as by using thermal grease or epoxy, or it can be metallurgically attached using a solder or braze, or making it an integral part of the module cap grid. In the figure, the hatched areas 11 can be spring-type contacts for snap-on mating to the module to which it is to be attached. The opening 13 in the heat sink will conform to the shape of the module and is not limited to the shape shown.

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Bow Tie Heat Sink

A bow-tie heat sink provides a low profile, extended surface heat sink to be used on electronic component modules to increase their thermal dissipation capabilities. The design, as shown above, maximizes air convection cooling surface area for a given module size and component height. This heat sink can be mechanically attached to a module such as by using thermal grease or epoxy, or it can be metallurgically attached using a solder or braze, or making it an integral part of the module cap grid. In the figure, the hatched areas 11 can be spring-type contacts for snap-on mating to the module to which it is to be attached. The opening 13 in the heat sink will conform to the shape of the module and is not limited to the shape shown.

The heat sink can be made of a very thin sheet material, such as copper or aluminum, and then press-formed into the desired shape very easily and inexpensively. To improve the heat transfer between the module cap and the heat sink, the hatched surfaces 11 can have a thermal grease on them to mate with the module surfaces for the low resistance thermal path. With the air flow as indicated by the directional areas, there is a significantly increased surface area of the bow-tie type heat sink to increase the module thermal dissipation capability.

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