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Organic Cap for First Level Packages

IP.com Disclosure Number: IPCOM000088638D
Original Publication Date: 1977-Jul-01
Included in the Prior Art Database: 2005-Mar-04
Document File: 2 page(s) / 34K

Publishing Venue

IBM

Related People

Greer, SE: AUTHOR

Abstract

An organic cap can be fabricated that will offer advantages over the standard aluminum caps plus the backseal type used to package semiconductor devices today.

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Organic Cap for First Level Packages

An organic cap can be fabricated that will offer advantages over the standard aluminum caps plus the backseal type used to package semiconductor devices today.

One or more plies of organic laminate material are shaped to the required package configuration and heated to the B-staged, but unpolymerized state to produce the cap 5. The cap 5 is placed over the substrate 6 which could be ceramic, and pressed and heated to both seal the edges 7 of the cap to the substrate and to further polymerize and rigidize the cap to produce the structure shown in Fig. 1. This encapsulates the semiconductor chip 8, which is electrically and physically connected to the substrate 6.

Selected areas of the cap and substrate are then plated with a metal, such as nickel or chromium, by conventional electroless and electroplating techniques, forming metal coating 9 of Fig. 2. The metal coating 9 provides a hermetic seal and a path for dissipation of heat generated within the package. The inside of the cap can also be metalized, thereby improving its thermal conductivity and allowing the joining of various conductive cooling junctions between the semiconductor chip and the cap. The cap can be made to flow and thereby allow the formation of optimized shapes or to conformally fit over the silicon chip. The conformal fit offers a direct conductive path out of the package.

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