Browse Prior Art Database

A Bimetallic Retention Device

IP.com Disclosure Number: IPCOM000088680D
Original Publication Date: 1977-Jul-01
Included in the Prior Art Database: 2005-Mar-04
Document File: 2 page(s) / 46K

Publishing Venue

IBM

Related People

Chu, RC: AUTHOR [+2]

Abstract

Thermal connection between individual heat dissipation components and a common cold plate is obtained by a bimetallic retention device which is designed such that the cold plate can be detached by simply heating up the device. Also, this same bimetallic device can be heated up to a certain temperature to allow the mounting stud, which extends from each module cap through the cold plate, to pass through. After cooling off, thermal contraction will cause the bimetallic device to close, thereby locking tight to the mounting stud or studs.

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A Bimetallic Retention Device

Thermal connection between individual heat dissipation components and a common cold plate is obtained by a bimetallic retention device which is designed such that the cold plate can be detached by simply heating up the device. Also, this same bimetallic device can be heated up to a certain temperature to allow the mounting stud, which extends from each module cap through the cold plate, to pass through. After cooling off, thermal contraction will cause the bimetallic device to close, thereby locking tight to the mounting stud or studs.

The figure shows the cold plate mounted to the module cap by a good thermal interface. The stud is shown extending from the module cap through the cold plate and the open bimetallic retainer. The stud contains ridges along its periphery such that the bimetallic retainer device, when closed, essentially provides a downward force on the mounting studs. The bimetallic arrangement allows the mounting of single or multiple components onto a cold plate quickly with uniform contact pressure. It also allows both individual or multiple component removal with ease and speed. The bimetallic device also provides positive contact between the cold plate and components via the mounting stud.

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