Browse Prior Art Database

Thermal Flex Connector

IP.com Disclosure Number: IPCOM000088684D
Original Publication Date: 1977-Jul-01
Included in the Prior Art Database: 2005-Mar-04
Document File: 2 page(s) / 34K

Publishing Venue

IBM

Related People

Antonetti, VW: AUTHOR [+4]

Abstract

The basic problem in removing heat from an array of modules to a rigid cold plate is that each module has a slightly different height off the board. The resulting air gaps between the modules and the cold plate are thermally unacceptable, especially for higher module powers.

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Thermal Flex Connector

The basic problem in removing heat from an array of modules to a rigid cold plate is that each module has a slightly different height off the board. The resulting air gaps between the modules and the cold plate are thermally unacceptable, especially for higher module powers.

Referring to the figure, there is shown a flexible thermal strap 10 which connects the individual modules 12 to a common "cooling bus" 18, which provides cooling water distribution to the board. Good thermal contact is achieved at the module 12 by a detachable joint which consists of a module stud and nut 14 which clamps the strap 10 against the module 12, thereby providing a pressure interface 16 at each module and making each module individually removable. The strap 10 is connected to the sides of the cold plate cooling bus 18 so as to make a good heat transfer interface. It should be noted that the cold plate cooling bus 18 is arranged to have its larger flat surfaces in the vertical plane so that this cooling bus can run between the modules and provide connection to either side thereof via the thermal straps 10.

This vertical arrangement of the cold plate cooling bus 18, in conjunction with the flexible thermal straps 10, provides a good heat sink regardless of the differences in height of the modules 12.

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