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Browse Prior Art Database

Heat Sinking Wafer Gripper

IP.com Disclosure Number: IPCOM000088814D
Original Publication Date: 1977-Aug-01
Included in the Prior Art Database: 2005-Mar-04
Document File: 2 page(s) / 26K

Publishing Venue

IBM

Related People

Greenstein, GM: AUTHOR [+2]

Abstract

This is a simple wafer-gripping mechanism provided with means for removing or conducting heat away from a semiconductor wafer held in the gripper assembly.

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Heat Sinking Wafer Gripper

This is a simple wafer-gripping mechanism provided with means for removing or conducting heat away from a semiconductor wafer held in the gripper assembly.

In semiconductor processing many process steps require that the wafer be held only by its edges and that minimal contact be maintained on the edges of the wafer. When the process to which the held wafer is being exposed heats the wafer, damage can occur because the fingers holding the edges cannot remove the heat fast enough from the wafer.

The basic assembly comprises a wafer-gripping mechanism 11 adapted to hold and position a semiconductor wafer 12 in a processing apparatus. The assembly 11 basically comprises a flat plate 13 supported on a centrally located spindle 14. The plate 13 is slightly snaller in size than the wafer 12, and carries a number of spring-loaded grippers 15 around its periphery which hold the wafer 12 a fixed distance from the plate 13.

Also located in the plate are a multiplicity of heat sinks 16 each of which is located in a through-hole 17 provided in the plate 13. Each heat sink 16 is provided with a large head 18 to contact the backside of the wafer 12 and aid in conducting heat away from the wafer 12. Each heat sink can also be provided with a second head 19 to prevent the heat sink from falling out of the plate 13.

For loading and unloading of the wafer, the assembly is inverted from the position shown in the figure, causing the heat sinks 16 to fall aw...