Browse Prior Art Database

Conduction Air Cooled Module

IP.com Disclosure Number: IPCOM000088849D
Original Publication Date: 1977-Aug-01
Included in the Prior Art Database: 2005-Mar-04
Document File: 2 page(s) / 24K

Publishing Venue

IBM

Related People

Hwang, U: AUTHOR

Abstract

A conduction cooling structure for air-cooled modules is shown in the drawing. When a semiconductor chip 3 is bonded contacts down by the solder reflow technique on a substrate 2, a high thermal resistance from chip to module is introduced. The illustrated structure provides a short thermal path from the back side of the chip 3 to module cover 4 and thus reduces module internal thermal resistance. This is accomplished by using a spring-loaded cylinder 5 to make a thermal contact with the back side of the chip 3 and a thermal compound 6 as an interface fluid to improve heat transfer. The guided cylinder wall 7 can have fins 8 thereon to improve external resistance.

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Conduction Air Cooled Module

A conduction cooling structure for air-cooled modules is shown in the drawing. When a semiconductor chip 3 is bonded contacts down by the solder reflow technique on a substrate 2, a high thermal resistance from chip to module is introduced. The illustrated structure provides a short thermal path from the back side of the chip 3 to module cover 4 and thus reduces module internal thermal resistance. This is accomplished by using a spring-loaded cylinder 5 to make a thermal contact with the back side of the chip 3 and a thermal compound 6 as an interface fluid to improve heat transfer. The guided cylinder wall 7 can have fins 8 thereon to improve external resistance.

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